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  february 2011 doc id 15610 rev 3 1/27 1 vn800ps-e high-side driver features ecopack ? : lead free and rohs compliant automotive grade: compliance with aec guidelines very low standby current cmos compatible input thermal shutdown protection and diagnosis undervoltage shutdown overvoltage clamp load current limitation reverse battery protection electrostatic discharge protection description the vn800ps-e is monolithic device made by using stmicroelectronics? vipower? m0-3 technology, intended for driving any kind of load with one side connected to ground. active v cc pin voltage clamp protects the device against low energy spikes. active current limitation combined with thermal shutdown and automatic restart protect the device against overload. device automatically turns off in case of ground pin disconnection. this device is especially suitable for industrial applications in norms conformity with iec1131 (programmable controllers international standard). type r ds(on) i out v cc vn800ps-e 135 m 0.7 a 36 v table 1. device summary package order codes tube tape and reel so-8 vn800ps-e VN800PSTR-E so-8 www.st.com
contents vn800ps-e 2/27 doc id 15610 rev 3 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 15 3.1.1 solution 1: resistor in the ground line (rgnd only) . . . . . . . . . . . . . . . . 15 3.1.2 solution 2: diode (dgnd) in the ground line . . . . . . . . . . . . . . . . . . . . . 16 3.2 microcontroller i/os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.3 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 so-8 maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . 19 4 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 so-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ecopack ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.2 so-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 so-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
vn800ps-e list of tables doc id 15610 rev 3 3/27 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 6. switching (v cc = 24 v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 8. v cc - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 9. status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 10. protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 11. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 12. electrical transient requirements on v cc pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 13. electrical transient requirements on v cc pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 14. electrical transient requirements on v cc pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 15. thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 16. so-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 17. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
list of figures vn800ps-e 4/27 doc id 15610 rev 3 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 4. status timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 5. switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 6. peak short circuit current test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 7. avalanche energy test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 8. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 9. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 10. off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 11. high level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 12. status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 13. on-state resistance vs t case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 14. on-state resistance vs v cc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 15. input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 16. input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 17. turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 18. overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 19. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 20. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 21. i lim vs t case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 22. so-8 maximum turn off current versus load inductance. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 23. demagnetization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 24. so-8 pc board (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 25. so-8 r thj-amb vs pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . 20 figure 26. so-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 27. thermal fitting model of a single channel hsd in so-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 28. so-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 29. so-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 30. so-8 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5
vn800ps-e block diagram and pin description doc id 15610 rev 3 5/27 1 block diagram and pin description figure 1. block diagram figure 2. configurati on diagram (top view) table 2. suggested connections for unused and not connected pins connection/pin status n.c. output input floating x x x x to ground x through 10 k resistor *1' ,1387 287387 67$786 9 && &855(17/,0,7(5 3rzhu&/$03 '5,9(5 *$3*&)7 9 &&  &/$03 29(592/7$*( '(7(&7,21 81'(592/7$*( '(7(&7,21 /2*,& 29(57(03(5$785( '(7(&7,21     *1' ,1387 67$786 1& 9 && 9 && 287387 287387 62 *$3*&)7
electrical specifications vn800ps-e 6/27 doc id 15610 rev 3 2 electrical specifications figure 3. current and voltage conventions 2.1 absolute maximum ratings ,1387 , 6 , ,1 9 && 67$786 *1' 9 && 9 287 , *1' 287387 9 ) , 287 , 67$7 9 67$7 9 ,1 *$3*&)7 table 3. absolute maximum ratings symbol parameter value unit so-8 v cc dc supply voltage 41 v - v cc reverse dc supply voltage -0.3 v - i gnd dc reverse ground pin current -200 ma i out dc output current internally limited a - i out reverse dc output current -6 a i in dc input current +/- 10 ma v in input voltage range -3/+v cc v v stat dc status voltage +v cc v v esd electrostatic discharge (human body model: r = 1.5 k ; c=100pf) - input - status - output - v cc 4000 4000 5000 5000 v v v v p tot power dissipation t c =25c 4.2 w e max maximum switching energy (l = 77.5 mh; r l =0 ; v bat =13.5v; t jstart = 150 c; i l =1.5a) 121 mj
vn800ps-e electrical specifications doc id 15610 rev 3 7/27 2.2 thermal data t j junction operating temperature internally limited c t c case operating temperature -40 to 150 c t stg storage temperature -55 to 150 c table 3. absolute maximum ratings (continued) symbol parameter value unit so-8 table 4. thermal data symbol parameter value unit so-8 r thj-lead thermal resistance junction-lead max 30 c/w r thj-amb thermal resistance junction-ambient max 93 (1) c/w 82 (2) c/w 1. when mounted on fr4 printed circuit board with 0.5 cm 2 of copper area (at least 35 m thick) connected to all v cc pins. 2. when mounted on fr4 printed circuit board with 2 cm 2 of copper area (at least 35 m thick).
electrical specifications vn800ps-e 8/27 doc id 15610 rev 3 2.3 electrical characteristics values specified in th is section are for 8 v< v cc <36v; -40c vn800ps-e electrical specifications doc id 15610 rev 3 9/27 i inh high level input current v in =3.25 v - 10 a v i(hyst) input hysteresis voltage 0.5 - v i in input current v in =v cc = 36 v - 200 a table 7. input pin (continued) symbol parameter test conditions min. typ. max. unit table 8. v cc - output diode symbol parameter test conditions min. typ. max. unit v f forward on voltage -i out = 0.6 a; t j = 150 c - - 0.6 v table 9. status pin symbol parameter test cond itions min. typ. max. unit v stat status low output voltage i stat =1.6 ma - - 0.5 v i lstat status leakage current normal operation; v stat =v cc =36v - - 10 a c stat status pin input capacitance normal operation; v stat =5v - - 30 pf table 10. protections (1) symbol parameter test cond itions min. typ. max. unit t tsd shutdown temperature 150 175 200 c t r reset temperature 135 c t hyst thermal hysteresis 7 15 c t sdl status delay in overload condition t j >t jsh 20 s i lim dc short circuit current v cc =24v; r load =10m 0.7 2 a v demag turn-off output clamp voltage i out =0.5a; l=6mh v cc -47 v cc -52 v cc -57 v 1. to ensure long term reliability under heavy overload or short circ uit conditions, protection and related diagnostic signals must be used together with a proper software strategy. if the dev ice is subjected to abnormal c onditions, this software must limit the duration and number of activation cycles.
electrical specifications vn800ps-e 10/27 doc id 15610 rev 3 figure 4. status timing table 11. truth table conditions input output status normal operation l h l h h h current limitation l h h l x x h (t j < t tsd ) h (t j > t tsd ) l over temperature l h l l h l undervoltage l h l l x x overvoltage l h l l h h 29(57(0367$7867,0,1* 7 m !7 mvk 9 ,1 9 67$7 w 6'/ w 6'/ *$3*&)7
vn800ps-e electrical specifications doc id 15610 rev 3 11/27 figure 5. switching time waveforms 9 287 g9 287 gw rq w u   w i 7 g rii 9 ,1 w w  7 g rq g9 287 gw rii *$3*&)7
electrical specifications vn800ps-e 12/27 doc id 15610 rev 3 table 12. electrical transient requirements on v cc pin (part 1/3) iso t/r 7637/1 test pulse test levels i ii iii iv delays and impedance 1 -25 v -50 v -75 v -100 v 2 ms, 10 2 +25 v +50 v +75 v +100 v 0.2 ms, 10 3a -25 v -50 v -100 v -150 v 0.1 s, 50 3b +25 v +50 v +75 v +100 v 0.1 s, 50 4 -4 v -5 v -6 v -7 v 100 ms, 0.01 5 +26.5 v +46.5 v +66.5 v +86.5 v 400 ms, 2 table 13. electrical transient requirements on v cc pin (part 2/3) iso t/r 7637/1 test pulse test levels results i ii iii iv 1cccc 2cccc 3acccc 3bcccc 4cccc 5c e e e table 14. electrical transient requirements on v cc pin (part 3/3) class contents c all functions of the device are performed as designed after exposure to disturbance. e one or more functions of the device is not performed as designed after exposure to disturbance and cannot be re turned to proper operation without replacing the device.
vn800ps-e electrical specifications doc id 15610 rev 3 13/27 figure 6. peak short circuit current test circuit figure 7. avalanche energy test circuit *1' n q 5 ,1 ,1387 287387 5 /  p q 9 && *1' 67$786 9 && &21752/ 81,7 *$3*&)7 *1' n q 5 ,1 ,1387 287387 /2$' 9 && *1' 67$786 9 && &21752/ 81,7 *$3*&)7
electrical specifications vn800ps-e 14/27 doc id 15610 rev 3 figure 8. waveforms 67$786 ,1387 1250$/23(5$7,21 /2$'92/7$*( 81'(592/7$*( 9 && 9 86' 9 86'k\vw ,1387 67$786 /2$'92/7$*( xqghilqhg 29(592/7$*( ,1387 67$786 9 && 9 29 /2$'92/7$*( 9 && 9 && !9 29 29(57(03(5$785( ,1387 67$786 7 76' 7 5 7 m /2$'&855(17 *$3*&)7
vn800ps-e application information doc id 15610 rev 3 15/27 3 application information figure 9. application schematic 3.1 gnd protection network against reverse battery 3.1.1 solution 1: resist or in the ground line (r gnd only) this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1) r gnd 600 mv / (i s(on)max ) 2) r gnd ( -v cc ) / (-i gnd ) where -i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device?s datasheet. power dissipation in r gnd (when v cc < 0: during reverse battery situations) is: p d = (-v cc ) 2 /r gnd this resistor can be shared amongst several different hsd. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not common with the device ground then the r gnd produces a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift varies depending on many devices are on in the case of several high side drivers sharing the same r gnd . ,1387q *1' 67$786q 287387q 9 9'& 9 && '*1' 9*1' 5*1' 5surw 5surw /2$' 5 / &rqwuro  gldjqrvwlf,2 %86 $6,& 9row 5hjxodwru 9 && *$3*&)7
application information vn800ps-e 16/27 doc id 15610 rev 3 if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the st s uggests to utilize solution 2 (see section 3.1.2 ). 3.1.2 solution 2: diode (d gnd ) in the ground line a resistor (r gnd =1k ) should be inserted in parallel to d gnd if the device is driving an inductive load. this small signal diode can be safely shared amongst several different hsd. also in this case, the presence of the ground network produces a shift ( 600 mv) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. this shift not varies if more than one hsd shares the same diode/resistor network. series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. safest configuration for unused input and status pin is to leave them unconnected. 3.2 microcontroller i/os protection if a ground protection network is used and negative transients are present on the v cc line, the control pins are pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the microcontroller i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of microcontroller and the current required by the hsd i/os (input levels compatibility) with the latch-up limit of microcontroller i/os. -v ccpeak /i latchup r prot (v ohc -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = -100 v and i latchup 20 ma; v ohc 4.5 v 5k r prot 65 k . recommended r prot value is 10 k .
vn800ps-e application information doc id 15610 rev 3 17/27 3.3 electrical char acteristics curves figure 10. off-state output current figure 11. high level input current figure 12. status leakage current figure 13. on-state resistance vs t case figure 14. on-state resistance vs v cc figure 15. input high level -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 il(off1) (a) off state vcc=36v vin=vout=0v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 1 2 3 4 5 6 7 8 iih (a) vin=3.25v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 ilstat (a) vstat=vcc=36v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 50 100 150 200 250 300 350 400 ron (mohm) iout=0.5a vcc=8v; 13v; 36v 5 10152025303540 vcc (v) 0 50 100 150 200 250 300 350 400 ron (mohm) iout=0.5a tc= - 40oc tc= 25oc tc= 150oc -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v)
application information vn800ps-e 18/27 doc id 15610 rev 3 figure 16. input low level figure 17. turn-on voltage slope figure 18. overvoltage shutdown figure 19. input hysteresis voltage figure 20. turn-off voltage slope figure 21. i lim vs t case -50 -25 0 25 50 75 100 125 150 175 tc (c) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 vil (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 200 400 600 800 1000 1200 1400 1600 dvout/dt(on) (v/ms) vcc=24v rl=48ohm -50 -25 0 25 50 75 100 125 150 175 tc (c) 30 32 34 36 38 40 42 44 46 48 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 100 200 300 400 500 600 700 800 dvout/dt(off) (v/ms) vcc=24v rl=48ohm -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 ilim (a) vcc=24v rl=10mohm
vn800ps-e application information doc id 15610 rev 3 19/27 3.4 so-8 maximum dema gnetization energy figure 22. so-8 maximum turn off current versus load inductance note: legend a = single pulse at t jstart = 150 oc b = repetitive pulse at t jstart =100oc c = repetitive pulse at t jstart = 125 oc conditions: v cc =13.5v values are generated with r l =0 in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves b and c. figure 23. demagnetization 0.1 1 10 1 10 100 1000 l(mh) i lmax (a) a b c 'hpdjqhwl]dwlrq 'hpdjqhwl]dwlrq 'hpdjqhwl]dwlrq w 9 ,1 , / *$3*&)7
package and pcb the rmal data vn800ps-e 20/27 doc id 15610 rev 3 4 package and pcb thermal data 4.1 so-8 thermal data figure 24. so-8 pc board (1) 1. layout condition of r th and z th measurements (pcb fr4 area = 58 mm x 58 mm, pcb thickness = 2 mm, cu thickness = 35 m, copper areas: 0.14 cm 2 , 2 cm 2 ). figure 25. so-8 r thj-amb vs pcb copper area in open box free air condition
vn800ps-e package and pcb thermal data doc id 15610 rev 3 21/27 figure 26. so-8 thermal impedance junction ambient single pulse figure 27. thermal fitting model of a single channel hsd in so-8 equation 1 pulse calculation formula where 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) 0.5 cm 2 2 cm 2 t_amb c1 r1 r2 c2 r3 c3 r4 c4 r5 c5 r6 c6 pd tj z th r th z thtp 1 ? () + ? = t p t ? =
package and pcb the rmal data vn800ps-e 22/27 doc id 15610 rev 3 table 15. thermal parameter area/island (cm 2 )0.142 r1 (c/w) 0.24 r2 (c/w) 1.2 r3 (c/w) 4.5 r4 (c/w) 21 r5 (c/w) 16 r6 (c/w) 58 28 c1 (w.s/c) 0.00015 c2 (w.s/c) 0.0005 c3 (w.s/c) 7.50e-03 c4 (w.s/c) 0.045 c5 (w.s/c) 0.35 c6 (w.s/c) 1.05 2
vn800ps-e package and packing information doc id 15610 rev 3 23/27 5 package and packing information 5.1 ecopack ? in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 5.2 so-8 package information table 16. so-8 mechanical data dim. mm min. typ. max. a 1.75 a1 0.1 0.25 a2 1.65 a3 0.65 0.85 b 0.35 0.48 b1 0.19 0.25 c 0.25 0.5 c1 45 d4.8 5 e 5.8 6.2 e1.27 e3 3.81 f3.8 4 l 0.4 1.27 m 0.6 s 8 l1 0.8 1.2
package and packing information vn800ps-e 24/27 doc id 15610 rev 3 figure 28. so-8 package dimensions 0016023 d
vn800ps-e package and packing information doc id 15610 rev 3 25/27 5.3 so-8 packing information the devices can be packed in tube or tape and reel shipments (see the device summary on page 1 ). figure 29. so-8 tube shipment (no suffix) figure 30. so-8 tape and reel shipment (suffix ?tr?) all dimensions are in mm. base q.ty 100 bulk q.ty 2000 tube length ( 0.5) 532 a 3.2 b 6 c ( 0.1) 0.6 c b a tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 12 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 5.5 compartment depth k (max) 4.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions all dimensions are in mm. base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 12.4 n (min) 60 t (max) 18.4
revision history vn800ps-e 26/27 doc id 15610 rev 3 6 revision history table 17. document revision history date revision changes 21-apr-2009 1 initial release 31-may-2010 2 updated features list. updated table 3: absolute maximum ratings . reformatted entire document. 07-feb-2011 3 updated features list. updated following tables: ? table 4: thermal data ? table 16: so-8 mechanical data
vn800ps-e doc id 15610 rev 3 27/27 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military , air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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